The wafer cutter is a coated one way tool, which represents
the optimum tool status - comparable to a spur toothed
shaping cutter. The thin, coated wafer disc is clamped in
a special wafer holder and mounted on the shaping cutter
holder of the shaping machine like a shaping cutter.
Advantages:
- Maximum process reliability
- Economical in mass production
- No changes in the gear profile as a result of wear
- Very easy machine adjustment (reduced setup time)
- Fully coated tools always in use
- Machine adjustment after wafer change not required during one series of workpieces
We can look back on 50 years of experience in the design,
development and manufacturing of gear tools at our plants
in Ettlingen and Turin. Through this continuity and ongoing
development, our customers have access to the extensive
technical knowledge of our specialists. In particular, this also
includes developing solutions and special designs for all
types of gears that can be manufactured by shaping processes in involute or non-involute profiles.
Shaping cutters are available as disc, hub, shank and internal
toothed hub types. PM materials and in special cases high quality hard metals are used.
Shape, designs and coatings are adapted and customised in
accordance with the gearing requirements.
Various hub, disc and shank type cutters are available from
our stock for different modules and pressure angles. They
can be delivered at short notice for standardised reference
profiles such as DIN 3972, DIN 5480, DIN 5482 and DIN 8197.
If required, semi-finished disc type shaping cutters are available,
from which we can manufacture express shaping cutters for
special gearing tasks at very short notice. The express shaping
cutters can generally be delivered within 10 business days.
Solid wafer cutters are used when a constant gear workpiece profile is required and thereby reducing the usable tool
height. Solid wafer cutters are available for any kind of spur
or helical toothed gears with an optimum coating for each
application. The solid wafer cutter has the same advantages
as the wafer even when used with smaller batch sizes.
In special cases solid wafer cutters can also be manufactured with different toothed sectors for up- and/or downstroke shaping processes.
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